Cray XC30 Supercomputer Series – The "Cascade" Program
The Cray XC30 supercomputer is Cray's next-generation supercomputing system. Known as the "Cascade" program while under development, the Cray XC30 system represents the culmination of a powerful industry collaboration and cutting-edge HPC research and development. Capable of sustained multi-petaflops performance on real-world applications, the Cray XC30 supercomputer features a hybrid architecture combining multiple processor technologies, a high performance network and a high performance computing-optimized operating system and programming environment.
The Cray XC30 supercomputer was made possible in part by Cray's participation in the Defense Advanced Research Projects Agency's (DARPA) High Productivity Computing Systems (HPCS) program. Run by the U.S. Department of Defense, DARPA formed the HPCS program to foster development of the next generation of high productivity computing systems for both national security and industrial user communities. Program goals were to develop more broadly applicable, easier to program and failure-resistant high performance computing systems. The Cray XC30 system represents the last phase of the three-phase HPCS program.
Processor technology. The Cray XC30 supercomputer is Cray's first system based on next-generation Intel® Xeon® processors. Its architecture enables support for a multiple processor lineup of Intel and other x86 processors as well as emerging coprocessors and accelerators.
Interconnect. With the Cray XC30 system, Cray will introduce the Aries interconnect – an interconnect chipset follow-on to Gemini with a new system interconnect topology called "Dragonfly." This innovative topology provides scalability in system size and global network bandwidth.
Software. Cray continues the evolution of the Cray Linux Environment with the Cray XC30 system, providing a software stack optimized for performance at scale of real-world HPC applications. Cray's programming environment combines flexibility and high productivity features to facilitate effective performance tuning and easy porting.
Packaging/Cooling. The Cray XC30 system will feature increased processor density with high efficiency cooling and power solutions.